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LaserVision SP3D Mini

Affordable 3D SPI – Laser

The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower-cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the affordable boundary on reliable, low-cost SPI solutions.

VisionPro SP3D

VisionPro SP3D

Benchtop SPI – Laser

The VisionPro SP3D offers laser-based accuracy for repeatable and reliable height measurements. Area and Volume can be calculated using template designs from Gerber import or user-defined regions. The ASCan Ultra software package drives the interface to a whole new user experience. Simple to operate, onboard SPC charting with custom data reports and a familiar Windows 10/11 Pro OS makes the VisionPro SP3D an easy choice when it comes to an accurate and reliable 3D Solder Paste Inspection solution.

VisionPro M500
Bestsellers

VisionPro M500

Benchtop 3D SPI – Moire

The VisionPro M500 system is sophisticated, true 3D technology coupled with an intuitive Windows® 10 OS. Packaged in a rugged, benchtop platform designed for show, engineered for the most advanced measurement requirements found within the stencil printing process. Offering a larger FOV sensor for better coverage and real-time, integrated SPC run charts and data reports, the VisionPro M500 provides exceptional value for the electronics manufacturer concerned with improving production yields.

VisionPro AP500

VisionPro AP500

Automated Offline 3D SPI

VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. VisionPro AP500’s completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.

VisionPro HSi

VisionPro HSi

High Speed Offline 3D SPI

VisionPro HSi is a high-speed, sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® 10/11 Pro user interface, and packaged in a rugged, bench-top portable system designed for the electronics production floor. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. VisionPro’s completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.

LineMaster DMI
Bestsellers

LineMaster DMI

Offline Dual Mode AOI-SPI

The LineMaster DMi is a revolutionary dual-mode 3D SPI and AOI offline platform combining the best of ASC International’s 3D SPI sensor technology with its sophisticated image / algorithm-based (Modeling) AOI sensor technology for the most comprehensive and value-packed inspection solution available today.

LineMaster Fusion 3D
Bestsellers

LineMaster Fusion 3D

Affordable Inline 3D SPI

LineMaster Fusion 3D provides a high-speed, inline sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. LineMaster’s completely automatic solder paste measurement process eliminates operator errors and offers outstanding repeatability at an affordable price.

AV 880 Series

AV 880 Series

AOI solutions

The AV 880 Series of AOI solutions from ASC International provides the same high-level inspection capabilities as found in our AV Series AOI systems all wrapped into an inline platform for continuous flow requirements. A price-to-performance ratio sure to please those looking for a quick ROI.

CyberOptics LSM
*Pre-Owned

CyberOptics LSM

Offline Solder Paste Inspection

CyberOptics is the world’s premier supplier of solder paste inspection equipment used to monitor and control one of the most crucial steps affecting the finished quality of circuit boards. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry’s first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process inspection on the assembly line. With more than 3000 systems installed worldwide, CyberOptics has the one of the largest installed base of solder paste inspection equipment in the industry. See for yourself why CyberOptics is #1 in 3D solder paste inspection technology.

Tabletop SPI
*Pre-Owned

CyberOptics LSM 2

Offline Solder Paste Inspection

CyberOptics is the world’s number-one supplier of solder paste inspection equipment used to monitor and control one of the most crucial steps affecting the finished quality of circuit boards.

Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry’s first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process inspection on the assembly line. With more than 3000 systems installed worldwide, CyberOptics has the largest installed base of solder paste inspection equipment in the industry. See for yourself why CyberOptics is #1 in 3D solder paste inspection technology.

CyberOptics LSM 300
*Pre-Owned

CyberOptics LSM 300

Offline SPI

CyberOptics is the world’s number-one supplier of solder paste inspection equipment used to monitor and control one of the most crucial steps affecting the finished quality of circuit boards. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry’s first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process inspection on the assembly line. With more than 3000 systems installed worldwide, CyberOptics has the largest installed base of solder paste inspection equipment in the industry. See for yourself why CyberOptics is #1 in 3D solder paste inspection technology.

CyberOptics QX150i
*Pre-Owned

CyberOptics QX150i

High Resolution 2D AOI

The QX150i™ is designed with an all-new SIM (Strobed Inspection Module) with enhanced illumination – delivering the best 01005 and solder joint inspection performance ever. With a higher sensor resolution (12 µm), you get to see crisp, perfect quality images for more accurate defect review. QX150i is equipped with SAM (Statistical Appearance Modeling) vision technology to give you the power to inspect ‘anything’ while keeping programming extremely simple – no algorithms to tune or parameters to adjust. SAM works in perfect harmony with AI² (Autonomous Image Interpretation) technology to enable fast programming and reliable discrimination against defects.