Advanced 3D Solder Paste Inspection System with Real-Time Analysis
Industry Leading Since 1992

Inspection That Delivers Results

±0.5 micron measurement repeatability. Under 1% false call rate on solder paste inspection. 85% defect reduction. 2,700+ installations worldwide.

±0.5 micron Repeatability
Zero-Config AI
Closed-Loop Control
Open Architecture
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Request a quote and talk to the engineers who built the system, not a call center.

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LineMaster Fusion 3D Inline SPI System
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FUSION_3D.MODEL
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Inline 3D SPISolder Paste InspectionSMEMA Compatible

LineMaster Fusion 3D

High-speed inline 3D solder paste inspection with fully automatic measurement, closed-loop printer feedback, and outstanding repeatability — at a price point that finally makes inline SPI accessible.

Catches drift before it becomes a defect. Inspects paste pads, BGAs, and PCB features with ±0.5 micron repeatability, all behind an intuitive Windows interface that runs without operator intervention.

High-speed inline 3D measurement
Fully automatic — no operator intervention
Closed-loop solder paste printer feedback
Inspects paste pads, BGAs, and PCB features
Outstanding measurement repeatability
Intuitive Windows user interface
SMEMA conveyor compatible
Affordable inline SPI entry point
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OUR SOLUTIONS

Cutting-Edge Inspection Systems

Precision quality control for electronics, semiconductor and industrial applications

3D Solder Paste Inspection

Advanced inline and offline SPI systems for precise solder paste measurement and verification.

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Automated Optical Inspection

State-of-the-art 2D-3D AOI systems for comprehensive quality control and defect detection.

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Digital Video Inspection

High-resolution digital video systems for detailed visual inspection and analysis.

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3D Industrial Metrology

Advanced laser scanning systems for precise 3D measurement and metrology.

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Jetting Valves

Precision jetting valves for solder paste and adhesive dispensing applications.

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PROVEN RESULTS

Results Our Customers Achieve

Real outcomes from real manufacturers, not awards on a shelf

85%
Defect Reduction
<1%
False Call Rate (solder paste inspection)
12–18 mo
Typical Payback

through scrap reduction and yield improvement

Trusted Across Industries

Automotive|Medical Devices|Aerospace & Defense|Contract Manufacturing|Semiconductor
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Ready to Improve Your Quality Control?

Contact our team for a consultation on how ASC International can optimize your inspection and measurement processes with industry-leading solutions for any application.

34+
Years Experience
2,700+
Installations Worldwide
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Why Choose ASC International?

Expertise and support for electronics, semiconductor and metrology professionals worldwide

Our own core technology

ASC's systems are built around scanning moiré interferometry, ASC's proprietary measurement method.

Direct Engineer Access

When you call ASC, you talk to the engineers who built your system — not a call center.

Quality Focused

Commitment to delivering the highest quality inspection solutions.

Expert Team

Experienced professionals dedicated to your manufacturing success.