LineMaster Fusion 3D provides a high-speed, inline sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. LineMaster’s completely automatic solder paste measurement process eliminates operator errors and offers outstanding repeatability at an affordable price.
VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. VisionPro AP500’s completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.
The AV 880 Series of AOI solutions from ASC International provides the same high-level inspection capabilities as found in our AV Series AOI systems all wrapped into an inline platform for continuous flow requirements. A price-to-performance ratio sure to please those looking for a quick ROI.
CyberOptics is the world’s premier supplier of solder paste inspection equipment used to monitor and control one of the most crucial steps affecting the finished quality of circuit boards. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry’s first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process inspection on the assembly line. With more than 3000 systems installed worldwide, CyberOptics has the one of the largest installed base of solder paste inspection equipment in the industry. See for yourself why CyberOptics is #1 in 3D solder paste inspection technology.
CyberOptics is the world’s number-one supplier of solder paste inspection equipment used to monitor and control one of the most crucial steps affecting the finished quality of circuit boards.
Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry’s first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process inspection on the assembly line. With more than 3000 systems installed worldwide, CyberOptics has the largest installed base of solder paste inspection equipment in the industry. See for yourself why CyberOptics is #1 in 3D solder paste inspection technology.
CyberOptics is the world’s number-one supplier of solder paste inspection equipment used to monitor and control one of the most crucial steps affecting the finished quality of circuit boards. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry’s first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process inspection on the assembly line. With more than 3000 systems installed worldwide, CyberOptics has the largest installed base of solder paste inspection equipment in the industry. See for yourself why CyberOptics is #1 in 3D solder paste inspection technology.
The multi-award winning QX500™ embraces CyberOptics unique image acquisition solution – Strobed Inspection Module (SIM) and is capable of inspecting 01005 components and larger at 200cm²/sec, securely positioning itself as the fastest area-scanning Automated Optical Inspection system in the industry. The QX500™ uses white strobed lighting, that consists of dual fixed angle lighting providing a superb image for defect review. You can further enhance component features by choosing a combination of lighting. QX500™ is designed to provide the IDEAL platform that can be integrated in assembly lines which manufacture memory modules, notebook PCS, mobile phones, automotive products, and other industrial electronic assemblies.
The QX600™ is designed with an all-new SIM (Strobed Inspection Module) with enhanced illumination – delivering the best 01005 and solder joint inspection performance ever. With a higher sensor resolution (12 µm), you get to see crisp, perfect quality images for more accurate defect review. QX600 is equipped with SAM (Statistical Appearance Modeling) vision technology to give you the power to inspect ‘anything’ while keeping programming extremely simple – no algorithms to tune or parameters to adjust. SAM works in perfect harmony with AI² (Autonomous Image Interpretation) technology to enable fast programming and reliable discrimination against defects.
CyberOptics is the world’s number-one supplier of solder paste inspection equipment used to monitor and control one of the most crucial steps affecting the finished quality of circuit boards. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry’s first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process inspection on the assembly line. With more than 3000 systems installed worldwide, CyberOptics has the largest installed base of solder paste inspection equipment in the industry. See for yourself why CyberOptics is #1 in 3D solder paste inspection technology.
CyberOptics is the world’s number-one supplier of solder paste inspection equipment used to monitor and control one of the most crucial steps affecting the finished quality of circuit boards. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry’s first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process inspection on the assembly line. With more than 3000 systems installed worldwide, CyberOptics has the largest installed base of solder paste inspection equipment in the industry. See for yourself why CyberOptics is #1 in 3D solder paste inspection technology.
CyberOptics is the world’s number-one supplier of solder paste inspection equipment used to monitor and control one of the most crucial steps affecting the finished quality of circuit boards. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry’s first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process inspection on the assembly line. With more than 3000 systems installed worldwide, CyberOptics has the largest installed base of solder paste inspection equipment in the industry. See for yourself why CyberOptics is #1 in 3D solder paste inspection technology.
The CyberOptics SE500, an advanced 100% 3D solder paste inspection system which re-defines inspection speed. This system has the ability to inspect the most demanding assemblies with a >70 cm2/second inspection speed that does not compromise measurement accuracy and repeatability. Building on CyberOptics’ reputation as the provider of solder paste inspection systems with industry-leading volume accuracy, the SE500 can inspect pad sizes down to 01005 component size (150µm x 150µm) while keeping up with ever-increasing line speeds. The SE500 product line has two models that accommodate different panel sizes. The SE500 features a conveyor that can transport panels from 50mm x 50mm (2in x 2in) up to 510mm x 510mm (20in x 20in). The SE500X can transport panels from 100mm x 100mm (4in x 4in) up to 810mm x 610mm (32in x 24in).
