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Legacy SPI

VisionPro AP-XT

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VisionPro APXT incorporates the sophisticated 3D measurement technology found in ASC International’s VisionPro AP500 systems in a production-ready positioning and fixturing system capable of handling double-sided SMT assemblies as large as 18%22 x 22%22 (450 mm x 550 mm). APXT automates the 3D solder paste measuring process and provides the accuracy and repeatability Electronic Manufacturers have come to expect from ASC International.

VisionPro HSi

High Speed Offline 3D SPI

VisionPro HSi is a high-speed, sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® 10/11 Pro user interface, and packaged in a rugged, bench-top portable system designed for the electronics production floor. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. VisionPro’s completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.

VisionPro M Series

Best In Class 3D SPI

The VisionPro M Series offers the flexibility of choosing either laser-based or structured white light sensor technology. Laser provides accurate cross-sectional height measurements along with area and volume calculations through user-defined regions. Structured white light offers the most comprehensive data set for true height, area, volume, and realistic 3D renderings of the solder deposits. Packaged in a rugged, benchtop platform designed for show, engineered for the most advanced measurement requirements found within the stencil printing process. Includes real-time, integrated SPC run charts, custom data reports, and simple-to-use Gerber-generated programs. The VisionPro M Series provides exceptional value for the budget-conscious electronics manufacturer concerned with improving production yields.

Legacy SPI

VisionPro M300

Item Subtitle

The VisionPro M300 system is sophisticated, true 3D technology coupled with an intuitive Windows® XP Pro / Windows 7 OS and packaged in a rugged, bench-top platform designed for show, engineered for the most advanced measurement requirements found within the SMT stencil printing process.  Utilizing the completely automatic measurement mode, errors associated with manual measurement subjectivity are eliminated making the VisionPro M300 an exceptional value for the electronics manufacturers concerned with improving production yields.

Bestsellers

VisionPro M500

Benchtop 3D SPI – Moire

The VisionPro M500 system is sophisticated, true 3D technology coupled with an intuitive Windows® 10 OS. Packaged in a rugged, benchtop platform designed for show, engineered for the most advanced measurement requirements found within the stencil printing process. Offering a larger FOV sensor for better coverage and real-time, integrated SPC run charts and data reports, the VisionPro M500 provides exceptional value for the electronics manufacturer concerned with improving production yields.

LineMaster Falcon

Affordable Inline 2D-3D AOI

The LineMaster Falcon AOI solution offered by ASC International provides manufacturers with a solid platform to validate the overall variables associated with component placement. State-of-the-art Detech2 Technology software detects attributes such as absence – presence, polarity, OCR, solder inspection and lead quality all with very low false call rates. The Falcon provides a value proposition unmatched in the industry. Call ASC today for a free consultation and onsite evaluation.

VisionPro Merlin

Affordable Offline 2D-3D AOI

The VisionPro Merlin AOI solution offered by ASC International provides manufacturers with a solid platform to validate the overall variables associated with component placement. State-of-the-art Detech2 Technology software detects attributes such as absence – presence, polarity, OCR, solder inspection and lead quality all with very low false call rates. The Merlin provides a value proposition unmatched in the industry. Call ASC today for a free consultation and onsite evaluation.