CyberOptics is the world’s number-one supplier of solder paste inspection equipment used to monitor and control one of the most crucial steps affecting the finished quality of circuit boards. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry’s first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process inspection on the assembly line. With more than 3000 systems installed worldwide, CyberOptics has the largest installed base of solder paste inspection equipment in the industry. See for yourself why CyberOptics is #1 in 3D solder paste inspection technology.
CyberOptics is the world’s number-one supplier of solder paste inspection equipment used to monitor and control one of the most crucial steps affecting the finished quality of circuit boards. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry’s first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process inspection on the assembly line. With more than 3000 systems installed worldwide, CyberOptics has the largest installed base of solder paste inspection equipment in the industry. See for yourself why CyberOptics is #1 in 3D solder paste inspection technology.
CyberOptics is the world’s number-one supplier of solder paste inspection equipment used to monitor and control one of the most crucial steps affecting the finished quality of circuit boards. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry’s first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process inspection on the assembly line. With more than 3000 systems installed worldwide, CyberOptics has the largest installed base of solder paste inspection equipment in the industry. See for yourself why CyberOptics is #1 in 3D solder paste inspection technology.
The CyberOptics SE500, an advanced 100% 3D solder paste inspection system which re-defines inspection speed. This system has the ability to inspect the most demanding assemblies with a >70 cm2/second inspection speed that does not compromise measurement accuracy and repeatability. Building on CyberOptics’ reputation as the provider of solder paste inspection systems with industry-leading volume accuracy, the SE500 can inspect pad sizes down to 01005 component size (150µm x 150µm) while keeping up with ever-increasing line speeds. The SE500 product line has two models that accommodate different panel sizes. The SE500 features a conveyor that can transport panels from 50mm x 50mm (2in x 2in) up to 510mm x 510mm (20in x 20in). The SE500X can transport panels from 100mm x 100mm (4in x 4in) up to 810mm x 610mm (32in x 24in).
The SE600™ – CyberOptics’ flagship SPI system, is the most advanced, high performance system ever. SE600™ brings together best accuracy and world-class usability on a single platform – making it the most ideal inspection solution for automotive, medical, military and other top niche markets.SE600™ comes with a standard dual illumination sensor designed to offer the best GR&R results – even on the very smallest of paste deposits. The award-winning new SPIV5 software offers revolutionary features that enable incredibly smarter and faster inspection.
The LaserVision SP3D combines laser measurement accuracy with Automatic Data Collection (ADC) for real-time control of SMT stencil printing. With its Windows® interface, the SP3D is easy to learn and use, making it an exceptional value for the SMT manufacturer concerned with improving printing and production yields.
VisionPro APXT incorporates the sophisticated 3D measurement technology found in ASC International’s VisionPro AP500 systems in a production-ready positioning and fixturing system capable of handling double-sided SMT assemblies as large as 18%22 x 22%22 (450 mm x 550 mm). APXT automates the 3D solder paste measuring process and provides the accuracy and repeatability Electronic Manufacturers have come to expect from ASC International.
The VisionPro M Series offers the flexibility of choosing either laser-based or structured white light sensor technology. Laser provides accurate cross-sectional height measurements along with area and volume calculations through user-defined regions. Structured white light offers the most comprehensive data set for true height, area, volume, and realistic 3D renderings of the solder deposits. Packaged in a rugged, benchtop platform designed for show, engineered for the most advanced measurement requirements found within the stencil printing process. Includes real-time, integrated SPC run charts, custom data reports, and simple-to-use Gerber-generated programs. The VisionPro M Series provides exceptional value for the budget-conscious electronics manufacturer concerned with improving production yields.
The VisionPro M300 system is sophisticated, true 3D technology coupled with an intuitive Windows® XP Pro / Windows 7 OS and packaged in a rugged, bench-top platform designed for show, engineered for the most advanced measurement requirements found within the SMT stencil printing process. Utilizing the completely automatic measurement mode, errors associated with manual measurement subjectivity are eliminated making the VisionPro M300 an exceptional value for the electronics manufacturers concerned with improving production yields.
The LineMaster Falcon AOI solution offered by ASC International provides manufacturers with a solid platform to validate the overall variables associated with component placement. State-of-the-art Detech2 Technology software detects attributes such as absence – presence, polarity, OCR, solder inspection and lead quality all with very low false call rates. The Falcon provides a value proposition unmatched in the industry. Call ASC today for a free consultation and onsite evaluation.
The VisionPro Merlin AOI solution offered by ASC International provides manufacturers with a solid platform to validate the overall variables associated with component placement. State-of-the-art Detech2 Technology software detects attributes such as absence – presence, polarity, OCR, solder inspection and lead quality all with very low false call rates. The Merlin provides a value proposition unmatched in the industry. Call ASC today for a free consultation and onsite evaluation.
The VisionPro Merlin XL AOI solution from ASC International builds upon the industry-leading Merlin with the addition of a larger platform to manage oversized boards. Accepting boards as large as 26″ x 22″. The Merlin XL meets the needs of those companies requiring large board capacity.
