SPI — Benchtop & Offline
Five systems that measure solder paste off the line, from the high-speed VisionPro HSi to the entry-level LaserVision SP3D Mini.
VisionPro HSi
High-speed portable benchtop 3D SPI system for the production floor. Accurate 3D measurements of paste pads, BGAs, and PCB features with excellent repeatability.
VisionPro AP500
ASC International's most popular VisionPro AP model — rugged benchtop 3D SPI with fully automatic measurement and minimal operator training required.
VisionPro SP3D
Laser-based benchtop SPI with reliable height, area, and volume measurements. Onboard SPC charting, custom data reports, and Windows 10/11 Pro via ASCan Ultra software.
VisionPro M500
Advanced true 3D benchtop SPI with 0.48μm Z-resolution, 6.8μm lateral resolution, and a larger FOV sensor for superior paste measurement in demanding applications.
LaserVision SP3D Mini
Affordable laser-based 3D SPI delivering the same measurement capability as the VisionPro SP3D on a cost-optimized platform. Customer-supplied PC option available.