LineMaster Fusion 3D

Affordable Inline 3D SPI

LineMaster Fusion 3D provides a high-speed, inline sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. LineMaster’s completely automatic solder paste measurement process eliminates operator errors and offers outstanding repeatability at an affordable price.

Description

Key Features & Benefits

  • PSI 1500® 3D Sensor Technology for Unmatched Accuracy and Precision
  • 20″ x 20″ Inspection Area (Up to 48″ x 24″ Optional)
  • Solder Paste Height, Area, Volume, X-Y Registration, Bridging Measurements
  • Photo Realistic 3D Profiles for Enhanced Qualitative Analysis
  • Onboard Real-Time SPC Run Charts with Full Data Traceability
  • Rapid 5-Minute GerberPro® Programming
  • Closed Loop Feedback
  • Offline Programming
  • NIST Calibration Standard
  • Optional Jetting Valves for Solder Paste, SMD Adhesives and More
  • Windows 10/11 Pro OS
  • 3 Year, End-User Warranty with Online Technical Support

Specifications

Inspection Speed .33 Sec./FOV
Height Accuracy 1µm (0.04 mils)
Gauge R&R <<10% (+/- 30% Tolerance)
Z Resolution 0.125 µm (.005 mils)
Lateral Resolution (X-Y) 8µm (.3 mils) / 4um (.15 mils) optional
Minimum Paste Deposit 51µm (2 Mils)

Data Sheets

 

Additional information

Systems

LineMaster