LineMaster Fusion 3D provides a high-speed, inline sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. LineMaster’s completely automatic solder paste measurement process eliminates operator errors and offers outstanding repeatability at an affordable price.
VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. VisionPro AP500’s completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.
CyberOptics is the world’s number-one supplier of solder paste inspection equipment used to monitor and control one of the most crucial steps affecting the finished quality of circuit boards. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry’s first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process inspection on the assembly line. With more than 3000 systems installed worldwide, CyberOptics has the largest installed base of solder paste inspection equipment in the industry. See for yourself why CyberOptics is #1 in 3D solder paste inspection technology.
The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower-cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the affordable boundary on reliable, low-cost SPI solutions.
The LineMaster DMi is a revolutionary dual-mode 3D SPI and AOI offline platform combining the best of ASC International’s 3D SPI sensor technology with its sophisticated image / algorithm-based (Modeling) AOI sensor technology for the most comprehensive and value-packed inspection solution available today.
The LineMaster DMi is a revolutionary dual-mode 3D SPI and AOI offline platform combining the best of ASC International’s 3D SPI sensor technology with its sophisticated image / algorithm-based (Modeling) AOI sensor technology for the most comprehensive and value-packed inspection solution available today.
VisionPro APXT incorporates the sophisticated 3D measurement technology found in ASC International’s VisionPro AP500 systems in a production-ready positioning and fixturing system capable of handling double-sided SMT assemblies as large as 18%22 x 22%22 (450 mm x 550 mm). APXT automates the 3D solder paste measuring process and provides the accuracy and repeatability Electronic Manufacturers have come to expect from ASC International.
VisionPro HSi is a high-speed, sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® 10/11 Pro user interface, and packaged in a rugged, bench-top portable system designed for the electronics production floor. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. VisionPro’s completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.
The VisionPro M Series offers the flexibility of choosing either laser-based or structured white light sensor technology. Laser provides accurate cross-sectional height measurements along with area and volume calculations through user-defined regions. Structured white light offers the most comprehensive data set for true height, area, volume, and realistic 3D renderings of the solder deposits. Packaged in a rugged, benchtop platform designed for show, engineered for the most advanced measurement requirements found within the stencil printing process. Includes real-time, integrated SPC run charts, custom data reports, and simple-to-use Gerber-generated programs. The VisionPro M Series provides exceptional value for the budget-conscious electronics manufacturer concerned with improving production yields.
The VisionPro M300 system is sophisticated, true 3D technology coupled with an intuitive Windows® XP Pro / Windows 7 OS and packaged in a rugged, bench-top platform designed for show, engineered for the most advanced measurement requirements found within the SMT stencil printing process. Utilizing the completely automatic measurement mode, errors associated with manual measurement subjectivity are eliminated making the VisionPro M300 an exceptional value for the electronics manufacturers concerned with improving production yields.
The VisionPro M500 system is sophisticated, true 3D technology coupled with an intuitive Windows® 10 OS. Packaged in a rugged, benchtop platform designed for show, engineered for the most advanced measurement requirements found within the stencil printing process. Offering a larger FOV sensor for better coverage and real-time, integrated SPC run charts and data reports, the VisionPro M500 provides exceptional value for the electronics manufacturer concerned with improving production yields.
