CyberOptics SE Series

High Speed Inline SPI

CyberOptics is the world’s number-one supplier of solder paste inspection equipment used to monitor and control one of the most crucial steps affecting the finished quality of circuit boards. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry’s first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process inspection on the assembly line. With more than 3000 systems installed worldwide, CyberOptics has the largest installed base of solder paste inspection equipment in the industry. See for yourself why CyberOptics is #1 in 3D solder paste inspection technology.

Description

Key Features & Benefits

  • CyberOptics Honored with Global Technology Award for CyberPrint OPTIMIZER Software
  • CyberOptics’ 3D SPI Solution Fully ‘Connected’ to Panasonic NPM Mounter APC System
  • CyberOptics’ Flagship SE600™ SPI System Wins 3rd Consecutive Award at NEPCON South China
  • CyberOptics Bags the Best Emerging Exhibit of the Year 2012 Award for its SE500ULTRA™ SPI System
  • CyberOptics Wins a 2010 Innovation Award for its SE500
  • CyberOptics wins 2009 Global Technology Award for its SE500™ at Productronica in Germany

Data Sheets

Additional information

Systems

CyberOptics