ASC International is your Global supplier of 3D Solder Paste Inspection Equipment. Check out our full line of 3D SPI equipment to see how we can increase your production yields and overall product quality through a strategic implementation of ASC’s many unique 3D Solder Paste Inspection solutions. Contact ASC International or a dealer near you for a live onsite demo of our 3D Solder Paste Inspection systems.
The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower-cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the affordable boundary on reliable, low-cost SPI solutions.
The VisionPro M500 system is sophisticated, true 3D technology coupled with an intuitive Windows® 10 OS. Packaged in a rugged, benchtop platform designed for show, engineered for the most advanced measurement requirements found within the stencil printing process. Offering a larger FOV sensor for better coverage and real-time, integrated SPC run charts and data reports, the VisionPro M500 provides exceptional value for the electronics manufacturer concerned with improving production yields.
VisionPro HSi is a high-speed, sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® 10/11 Pro user interface, and packaged in a rugged, bench-top portable system designed for the electronics production floor. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. VisionPro’s completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.
VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. VisionPro AP500’s completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.
LineMaster Fusion 3D provides a high-speed, inline sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. LineMaster’s completely automatic solder paste measurement process eliminates operator errors and offers outstanding repeatability at an affordable price.
The VisionPro SP3D offers laser-based accuracy for repeatable and reliable height measurements. Area and Volume can be calculated using template designs from Gerber import or user-defined regions. The ASCan Ultra software package drives the interface to a whole new user experience. Simple to operate, onboard SPC charting with custom data reports and a familiar Windows 10/11 Pro OS makes the VisionPro SP3D an easy choice when it comes to an accurate and reliable 3D Solder Paste Inspection solution.
The LineMaster DMi is a revolutionary dual-mode 3D SPI and AOI offline platform combining the best of ASC International’s 3D SPI sensor technology with its sophisticated image / algorithm-based (Modeling) AOI sensor technology for the most comprehensive and value-packed inspection solution available today.