Showing all 10 results

Legacy SPI

LaserVision SP3D

Affordable Offline 3D SPI

The LaserVision SP3D combines laser measurement accuracy with Automatic Data Collection (ADC) for real-time control of SMT stencil printing. With its Windows® interface, the SP3D is easy to learn and use, making it an exceptional value for the SMT manufacturer concerned with improving printing and production yields.

Legacy SPI

VisionMaster® 450

Offline 3D SPI

The VM450 is the latest development in True 3D measurement technology. Integration of a color camera with a larger Field of View (FOV), while still retaining .07 mil resolution, allows operators to measure everything from 0201’s and micro-BGA’s to your largest applications. With its Windows® interface, the VM450 is easy to learn and use, making it an exceptional value for the SMT manufacturer concerned with improving printing and production yields.

Legacy SPI

VisionMaster® AP212

Automated Offline 3D SPI

The VisionMaster® AP212 incorporates high-resolution PCB positioning with sophisticated, 3-dimensional measurement technology found in ASC Internationals’ popular VisionMaster 150 to provide electronics manufacturers’ with the most automatic and accurate 3-D solder paste measurement tool in its class. The AP212 eliminates operator handling problems associated with other off-line measurement and inspection systems, improving repeatability and reproducibility. This makes the AP212 an exceptional value for the electronics manufacturer concerned with improving production yields.

Legacy SPI

VisionMaster® AP450

Offline 3D SPI

VisionMaster AP450 incorporates high- resolution PCB positioning with sophisticated, high speed 3-dimensional measurement technology found in ASC Internationals’ popular VisionMaster450 to provide electronics manufacturers’ with the most automatic and accurate 3-D solder paste measurement tool in its class. The AP450 eliminates operator handling problems associated with other off-line measurement and inspection systems, improving repeatability and reproducibility. This makes the AP450 an exceptional value for the electronics manufacturer concerned with improving production yields.

Legacy SPI

VisionPro M300

Item Subtitle

The VisionPro M300 system is sophisticated, true 3D technology coupled with an intuitive Windows® XP Pro / Windows 7 OS and packaged in a rugged, bench-top platform designed for show, engineered for the most advanced measurement requirements found within the SMT stencil printing process.  Utilizing the completely automatic measurement mode, errors associated with manual measurement subjectivity are eliminated making the VisionPro M300 an exceptional value for the electronics manufacturers concerned with improving production yields.

Legacy SPI

VisionPro® AP212

Automated Offline SPI

VisionPro AP212 is a sophisticated 3D solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. VisionPro’s completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.

Legacy SPI

VisionPro AP-XT

Item Subtitle

VisionPro APXT incorporates the sophisticated 3D measurement technology found in ASC International’s VisionPro AP500 systems in a production-ready positioning and fixturing system capable of handling double-sided SMT assemblies as large as 18%22 x 22%22 (450 mm x 550 mm). APXT automates the 3D solder paste measuring process and provides the accuracy and repeatability Electronic Manufacturers have come to expect from ASC International.