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Legacy SPI

VisionPro M300

Item Subtitle

The VisionPro M300 system is sophisticated, true 3D technology coupled with an intuitive Windows® XP Pro / Windows 7 OS and packaged in a rugged, bench-top platform designed for show, engineered for the most advanced measurement requirements found within the SMT stencil printing process.  Utilizing the completely automatic measurement mode, errors associated with manual measurement subjectivity are eliminated making the VisionPro M300 an exceptional value for the electronics manufacturers concerned with improving production yields.

Legacy SPI

VisionPro® AP212

Automated Offline SPI

VisionPro AP212 is a sophisticated 3D solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. VisionPro’s completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.

Legacy SPI

VisionPro AP-XT

Item Subtitle

VisionPro APXT incorporates the sophisticated 3D measurement technology found in ASC International’s VisionPro AP500 systems in a production-ready positioning and fixturing system capable of handling double-sided SMT assemblies as large as 18%22 x 22%22 (450 mm x 550 mm). APXT automates the 3D solder paste measuring process and provides the accuracy and repeatability Electronic Manufacturers have come to expect from ASC International.