VisionPro M Series

Best In Class 3D SPI

The VisionPro M Series offers the flexibility of choosing either laser-based or structured white light sensor technology. Laser provides accurate cross-sectional height measurements along with area and volume calculations through user-defined regions. Structured white light offers the most comprehensive data set for true height, area, volume, and realistic 3D renderings of the solder deposits. Packaged in a rugged, benchtop platform designed for show, engineered for the most advanced measurement requirements found within the stencil printing process. Includes real-time, integrated SPC run charts, custom data reports, and simple-to-use Gerber-generated programs. The VisionPro M Series provides exceptional value for the budget-conscious electronics manufacturer concerned with improving production yields.

Description

Key Features & Benefits

  • Attractive Space-saving Design
  • Best in Class Gage R&R
  • Measure Height, Area, Volume
  • SPC Run Charts/Data Reports
  • 3D – Qualitative Analysis
  • Service Free USB Interface
  • ZERO Cost Online Training
  • Windows® 10/11 Pro OS
  • Large ESD Safe Work Surface
  • One-Year, End-User Warranty
  • High-Resolution Color CCD Camera
  • Dell® PC / 23″ LCD Monitor
  • Optional Manual X-Y Stage
  • Optional NIST Calibration Tool

Specifications

Inspection Speed .33 Sec/FOV
Z Resolution .48 μm (.019 mils)
Gage R & R (+/- 50% tolerance on PCB <10%
Height Accuracy on Cal Target 1 μm (.04 mils)
Minimum Paste Deposit Size (X, Y) 51 μm (2 mils)

Data Sheets

Additional information

Systems

VisionPro