AOI Technology
Automated Optical Inspection (AOI)
AOI Systems provided by ASC International employ a number of unique and innovative lighting technologies and algorithm-based tools to eliminate escapes and reduce false call rates.
Image Matching
The high-resolution color camera captures the image of the components and then through a series of algorithms determines if the components are acceptable based on features such as image size, position, brightness, and pasting angle.
Statistical Image Modeling
Images are compared to a large library of master images collected during the “learn mode” in order to provide as many possible variations as associated with the component manufacturing process.
Optical LED Analytics
Using a high-resolution color camera along with an LED lighting scheme and RGB-W principles, images are analyzed based on reflection, refraction, and angular reflection characteristics.
SPI Technology
Solder Paste Inspection (SPI)
The core technologies for ASC International’s Solder Paste Inspection systems are laser-based or structured white light moiré interferometry.
Laser-Based Technology
How does laser-based technology work?
Utilizing the core principles of laser triangulation, a laser stripe is projected at a specific angle to the imaging camera. As the laser moves across the surface, a string of data is automatically collected from the centroid of the laser stripe generating a differential height reading from the base surface to the overall surface of the solder paste deposit. Single laser stripe SPI systems provide accurate and reliable height characteristics along with 2D cross-sectional profiles whereas laser scanning sensor SPI systems can provide accurate and reliable height, area, and volume characteristics with more complete 3D profiles for advanced qualitative analysis. Laser Technology based SPI systems are typically require less of an investment, yet still provide sufficient data results for basic height, width and area measurements.
There are over 40 variables associated with the solder paste printing process. The key to a successful yield improvement strategy is understanding these variables and creating a proactive approach to process control.
Structured White Light Moiré Interferometry
How does structured white light moiré interferometry technology work?
A known light pattern is projected onto a surface with the image being transferred to a high-resolution camera. On a flat surface, the projected pattern image appears to be undistorted to the camera. On a contoured surface such as a freshly printed circuit board, the pattern will follow the height variations from the surface to the solder deposits and these images will appear distorted to the camera. The distorted image is compared with the undistorted image and the difference is directly related to the height of the contoured object at every pixel. Pixel-by-pixel data replication as provided by this technology offers the most accurate and reliable method for obtaining true 3D, volumetric measurements critical to your overall screen print process strategy.
There are over 40 variables associated with the solder paste printing process. The key to a successful yield improvement strategy is understanding these variables and creating a proactive approach to process control.
Process Control Strategies
Quality Inspection Solutions for Improved Yields, Process Control & Operational Efficiencies
Recognized Leader in Quality Inspection Solutions.
Your Partner for Improved Yields & Process Control
Show your customers you are a quality-focused manufacturing company… invest in AOI and SPI.
Manufacturing quality into your products begins at the point when proactive process control strategies are implemented. Asking yourself the questions, “Why inspect components” and “Why inspect solder paste” provides the valuable information necessary to justify the need for these critical process improvement tools.
Save Time & Expense
- Improve yields, uptime and throughput
- Improve Quality
- Improve process control and operational efficiencies
- Establish repeatable and verifiable standards
- Reduce training time and resource needs
- Reduce rework costs
- Manufacturing facilities worldwide are significantly improving yields, quality and operational efficiencies using ASC International’s systems for automated optical inspection (AOI), solder paste inspection (SPI) and coordinate measurements (CMM).
Why Inspect Components?
Component placement inspection has become even more critical over the past decade due to package sizes getting smaller and smaller. The key to a successful yield improvement strategy is understanding these placement defects and creating a proactive approach to process control.
Why Inspect Solder Paste?
There are over 40 variables associated with the solder paste printing process. The key to a successful yield improvement strategy is understanding these variables and creating a proactive approach to process control.
Why Inspect?
Learn more about the benefits of inspecting solder paste and components.
We’re Flexible
We Offer a Wide Variety of Products & Services!
Suspendisse potenti. Proin quam massa, aliquam porta neque id, condimentum porttitor erat. Nunc gravida laoreet placerat. Morbi non augue est. Fusce facilisis dictum lorem id mattis.