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3D Solder Paste Inspection System
Legacy SPI

VisionMaster® 450

Offline 3D SPI

The VM450 is the latest development in True 3D measurement technology. Integration of a color camera with a larger Field of View (FOV), while still retaining .07 mil resolution, allows operators to measure everything from 0201’s and micro-BGA’s to your largest applications. With its Windows® interface, the VM450 is easy to learn and use, making it an exceptional value for the SMT manufacturer concerned with improving printing and production yields.

VisionMaster® AP212
Legacy SPI

VisionMaster® AP212

Automated Offline 3D SPI

The VisionMaster® AP212 incorporates high-resolution PCB positioning with sophisticated, 3-dimensional measurement technology found in ASC Internationals’ popular VisionMaster 150 to provide electronics manufacturers’ with the most automatic and accurate 3-D solder paste measurement tool in its class. The AP212 eliminates operator handling problems associated with other off-line measurement and inspection systems, improving repeatability and reproducibility. This makes the AP212 an exceptional value for the electronics manufacturer concerned with improving production yields.

3D Solder Paste Inspection
Legacy SPI

VisionMaster® AP450

Offline 3D SPI

VisionMaster AP450 incorporates high- resolution PCB positioning with sophisticated, high speed 3-dimensional measurement technology found in ASC Internationals’ popular VisionMaster450 to provide electronics manufacturers’ with the most automatic and accurate 3-D solder paste measurement tool in its class. The AP450 eliminates operator handling problems associated with other off-line measurement and inspection systems, improving repeatability and reproducibility. This makes the AP450 an exceptional value for the electronics manufacturer concerned with improving production yields.