SPI

Solder Paste Inspection

ASC International is your Global supplier for 3D Solder Paste Inspection solutions. Check out our full line of 3D SPI equipment to see how we can increase your production yields and overall product quality through a strategic implementation of ASC’s many unique 3D Solder Paste Inspection solutions. Contact ASC International or a dealer near you for a live remote demo or onsite evaluation.

TableTop 3D SPI Systems

LaserVision SP3D Mini

Affordable 3D SPI – Laser

The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower-cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the affordable boundary on reliable, low-cost SPI solutions.

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Bestsellers

VisionPro M500

Benchtop 3D SPI – Moire

The VisionPro M500 system is sophisticated, true 3D technology coupled with an intuitive Windows® 10 OS. Packaged in a rugged, benchtop platform designed for show, engineered for the most advanced measurement requirements found within the stencil printing process. Offering a larger FOV sensor for better coverage and real-time, integrated SPC run charts and data reports, the VisionPro M500 provides exceptional value for the electronics manufacturer concerned with improving production yields.

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VisionPro SP3D

Benchtop SPI – Laser

The VisionPro SP3D offers laser-based accuracy for repeatable and reliable height measurements. Area and Volume can be calculated using template designs from Gerber import or user-defined regions. The ASCan Ultra software package drives the interface to a whole new user experience. Simple to operate, onboard SPC charting with custom data reports and a familiar Windows 10/11 Pro OS makes the VisionPro SP3D an easy choice when it comes to an accurate and reliable 3D Solder Paste Inspection solution.

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VisionPro AP500

Automated Offline 3D SPI

VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. VisionPro AP500’s completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.

LineMaster DMi White SMT & SPI - Automated AOI
Bestsellers

LineMaster DMi

Offline Dual Mode AOI-SPI

The LineMaster DMi is a revolutionary dual-mode 3D SPI and AOI offline platform combining the best of ASC International’s 3D SPI sensor technology with its sophisticated image / algorithm-based (Modeling) AOI sensor technology for the most comprehensive and value-packed inspection solution available today.

VisionPro HSI White SMT & SPI - Automated AOI

VisionPro HSi

High Speed Offline 3D SPI

VisionPro HSi is a high-speed, sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® 10/11 Pro user interface, and packaged in a rugged, bench-top portable system designed for the electronics production floor. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. VisionPro’s completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.

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Bestsellers

LineMaster Fusion 3D

Affordable Inline 3D SPI

LineMaster Fusion 3D provides a high-speed, inline sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface. With only a few minutes of training, an operator can perform accurate 3D measurements of solder paste pads, BGAs, and many other PCB features. LineMaster’s completely automatic solder paste measurement process eliminates operator errors and offers outstanding repeatability at an affordable price.

Why Inspect Solder Paste?

There are over 40 variables associated with the solder paste printing process. The key to a successful yield improvement strategy is understanding these variables and creating a proactive approach to process control.

Enhance Your Production Efficiency with 3D SPI Systems

ASC International offers a comprehensive range of 3D SPI systems, both inline and offline, at highly competitive prices. Our cutting-edge technology ensures improved production yields and process control, addressing crucial aspects of the PCB assembly process.

Integrated 3D SPI Solutions

As PCB assembly grows more intricate, ensuring precise solder paste deposition is paramount for reliable solder joints. Our 3D SPI equipment detects and corrects issues related to solder paste height, area, and volume, ensuring long-term reliability and high-quality output.

Effective Solder Paste Inspection

Our 3D SPI systems provide rapid and accurate inspection of each solder paste deposit, enabling immediate corrective actions to maintain process integrity and efficiency.

Benefits of Our Solutions

Incorporating our 3D Solder Paste Inspection equipment into your manufacturing process offers numerous advantages:

  • Immediate feedback for effective corrective action
  • Enhanced overall process efficiencies
  • Consistently high-quality boards
  • High-resolution inspection technology
  • Significant return on investment

Discover the Difference

Experience the value of our highly accurate 3D SPI equipment firsthand with a no-obligation onsite print evaluation. Contact us or your local dealer for a live demonstration of our 3D Solder Paste Inspection systems.

Contact Information

Toll-Free: 888-478-2912

ASC International: Your Global Supplier of 3D Solder Paste Inspection Equipment

Explore our full line of 3D SPI equipment and elevate your production yields and product quality with ASC’s innovative solutions.