VisionPro Merlin Offline 2D-3D AOI System
Offline AOI2D-3D

VisionPro Merlin

Affordable offline 2D-3D automated optical inspection system using Detech2 Technology for comprehensive component and solder quality verification.

The VisionPro Merlin detects absence/presence, polarity, OCR, solder defects, and lead quality with very low false call rates. It uses a 12 MP CCD camera with a telecentric lens over a standard 20″ × 16″ board area, with 24″ × 20″ available as an option. A laser sensor for component and lead height is also optional.

Affordable offline 2D-3D AOI
Detech2 Technology defect detection
12 MP CCD camera, telecentric lens
Optional laser sensor for height checks
Standard area: 20" × 16"
Optional 24" × 20" board size
Absence, polarity, OCR, solder, lead quality
Very low false call rate
// Specifications

VisionPro Merlin specifications

An offline AOI station for boards up to 510 mm x 408 mm (609 mm x 508 mm optional) with components down to 01005. Laser height, UV conformal coating and 3D SPI checks are added as options.

System Overview

Software PackageDetech 2
Minimum Component Size01005 and Above
Operating SystemWindows 11 Pro
CommunicationEthernet / SMEMA
Electrical Requirements100-240 VAC, 50-60 Hz, 2 Amps
Ambient Operating Temperature5˚ - 38˚ C (40˚ - 100˚ F)
Ambient Operating Humidity<90% non-condensing

Vision System

Camera Technology12MP CCD Camera
Lens TechnologyTelecentric
X-Y Pixel Resolution8 um (0.31 mils)
Field of View (FOV)45 mm x 30 mm (1.77 x 1.18 in)
IlluminationRGBW+ (UV)

Inspection Performance

Standard PCB Size510 mm x 408 mm (20.0 x 16.0 in)
Minimum PCB Size50 mm x 50 mm (2.0 x 2.0 in)
Maximum PCB Size (Optional)609 mm x 508 mm
PCB Thickness0.6 mm - 8 mm
Top / Bottom Clearance45 mm / 40 mm
Board Weight3 Kg (6.61 lbs)

System Dimensions

Dimensions (H x W x L)1680 mm x 973 mm x 1191 mm

What it measures

  • Presence/Absence
  • Polarity
  • Offset
  • OCV /OCR
  • Billboarding
  • Tombstone
  • Lifted leads
  • Missing Solder
  • Bridging

Options

  • Offline Workstations
  • Laser Sensor
  • Conformal Coating (UV)
  • 3D SPI Sensor

Source: VisionPro Merlin datasheet. Specifications can change; confirm current figures with ASC when you request a quote.

Common questions about the VisionPro Merlin

What is the smallest component the Merlin can inspect?

The datasheet lists a minimum component size of 01005 and above.

What board sizes does it accept?

Standard PCB size is 510 mm x 408 mm. Minimum is 50 mm x 50 mm. An optional maximum of 609 mm x 508 mm is listed. Board thickness is 0.6 mm to 8 mm and board weight is 3 Kg.

Does it measure component or lead height?

Not in the standard configuration. A laser sensor for component and lead height validation is listed as an option.

What camera and resolution does it use?

A 12MP CCD camera with a telecentric lens, 8 um (0.31 mils) X-Y pixel resolution and a 45 mm x 30 mm field of view.

Full Specifications

The datasheet covers dimensions, camera and vision system specs, and full defect detection capabilities.