Semiconductor Inspection Solutions
High-resolution solder paste inspection for fine-pitch paste on substrates and packages, plus AOI
What is Semiconductor Inspection?
Semiconductor assembly and advanced packaging depend on fine-pitch solder paste printed on substrates and packages. ASC sells high-resolution solder paste inspection for that paste, plus AOI for the assemblies.
SPI measures paste on substrates and packages used in advanced packaging. AOI inspects the assemblies those processes produce.
Semiconductor Manufacturing Challenges We Solve
Fine-Pitch Paste
Advanced packaging prints fine-pitch solder paste on substrates and packages. High-resolution SPI measures those deposits. AOI inspects the assemblies that follow.
- • Solder paste inspection on substrates and packages
- • Height and volume measurement of fine-pitch paste
- • AOI for semiconductor assembly
Cleanroom Compatibility
Semiconductor fabs operate under stringent environmental controls. Inspection equipment must meet cleanroom particle generation standards while maintaining measurement accuracy across tightly controlled temperature and humidity ranges.
- • ISO Class 5 (Class 100) cleanroom compatible
- • Low-outgassing materials and construction
- • ESD-safe design throughout
Yield Optimization
In advanced packaging, even small yield improvements matter. Inspection data from SPI and AOI should be actionable, so manufacturers can find systematic defect sources.
- • Systematic vs. random defect classification
- • Process window optimization feedback
- • Die-level yield prediction models
Defect Density Management
Advanced packaging prints solder paste on substrates and packages, then assembles those packages. SPI and AOI cover those two steps.
- • Multi-layer defect tracking through process flow
- • Known-good-die (KGD) verification
- • Interconnect integrity assessment
- • Statistical defect density monitoring
Semiconductor Inspection Solutions
High-Resolution Solder Paste Inspection
ASC's high-resolution SPI systems measure fine-pitch solder paste on substrates and packages used in advanced packaging, including system-in-package and chiplet-based assemblies.
Ultra-Fine-Pitch SPI
Volume and height measurement on paste deposits with pitches below 200 microns for advanced packages
Substrate-Level Inspection
Inspect solder paste on organic and ceramic substrates used in multi-chip module assembly
Process Feedback
Real-time SPC data loops to stencil printers and dispensing equipment for closed-loop process control
Ultra-High-Resolution AOI
Purpose-built for semiconductor packaging inspection, our AOI platforms combine multi-angle optics with advanced algorithms to detect defects invisible to standard electronics inspection systems. From wire bond verification to package-level cosmetic inspection, these systems deliver the sensitivity semiconductor applications demand.
Wire Bond Inspection
Verify bond placement, loop height, ball shape, and stitch quality for gold and copper wire bonding
Die Attach Verification
Confirm die placement accuracy, tilt, adhesive coverage, and fillet formation on leadframes and substrates
Package-Level Inspection
Final outgoing quality inspection for package marking, lead coplanarity, and cosmetic defects
Standards Semiconductor Customers Meet
Semiconductor manufacturers and advanced-packaging suppliers work to standards such as these. IATF 16949 is what automotive semiconductor suppliers must meet.
SEMI Standards
SEMI E10, E79, and E142 for equipment reliability, utilization tracking, and overall equipment effectiveness (OEE) in semiconductor manufacturing
ISO 14644 Cleanroom
Cleanroom classification and contamination control standards used in semiconductor manufacturing environments
IPC-7711/7721
Rework, modification, and repair standards for semiconductor packages with detailed defect documentation and process traceability
JEDEC Standards
JEDEC J-STD-020 moisture sensitivity, J-STD-033 handling, and package reliability testing standards for semiconductor devices
AEC-Q Standards
Automotive Electronics Council qualification standards for semiconductor components destined for automotive applications
IATF 16949
Automotive quality management system requirements for semiconductor suppliers serving the automotive supply chain
Common Applications
Flip-Chip Assembly
AOI for flip-chip assemblies used in advanced packaging.
Advanced Packaging
Solder paste inspection and AOI for advanced packaging, including system-in-package (SiP) and chiplet assemblies on substrates and packages.
LED Manufacturing
Inspection of LED die bonding, phosphor application, and chip-scale packaging. Verify die placement accuracy, wire bond quality, and optical alignment for high-brightness LED and micro-LED production.
Power Semiconductor Packaging
Inspection of power modules including IGBT, SiC, and GaN devices. Verify large-area solder interfaces, wire bond and ribbon bond quality, and thermal management structures critical for power electronics reliability.
MEMS & Sensor Packaging
Specialized inspection for MEMS devices, image sensors, and other sensitive semiconductor components requiring careful handling and high-resolution quality verification during assembly and packaging.
Why Semiconductor Manufacturers Choose ASC
Vendor-Independent
Our open architecture integrates with any equipment on your line. No vendor lock-in means you choose the best tools for each process step.
Production Throughput
High-speed scanning and parallel processing ensure inspection keeps pace with your production volume without creating bottlenecks.
Yield-Driven Analytics
Advanced data analytics transform raw inspection data into actionable yield improvement insights with Pareto charts and trend analysis.
Maximize Your Semiconductor Yield
Contact us to discuss how ASC inspection solutions can improve yield and quality in your semiconductor operations