VisionPro AP500

VisionPro AP500, the most popular model of ASC International’s VisionPro AP family, is a sophisticated 3-dimensional solder paste measurement system coupled with an intuitive Windows® user interface, and packaged in a rugged, bench-top system designed for the electronics production floor. With only a few minutes training, an operator can perform accurate 3D measurements of solder paste pads, BGA’s and many other PCB features. VisionPro AP500’s completely automatic solder paste measurement process eliminates operator errors and offers excellent measurement repeatability.

Key Features & Benefits

  • Multiple Sensor Options: SP3D & PSI
  • Automated Height, Area,Volume, Offset
  • Gerber Programming & Auto-Scripting
  • Defect Error Review
  • Built-in Data and SPC Charting
  • Color 3D Profiles of Measured Features
  • ASCan Ultra Measurement Software
  • Dell® PC and Windows® 7 OS
  • 20″ x 20″ Board Capacity
  • 12″ x 20″ Max Board Inspection Area
  • NIST Traceable Standard
  • Hardware/Software Reference and Online Help

Specifications

Inspection Speed .33 Sec./FOV
Height Accuracy 1µm (0.00004”)
Gauge R&R <<10% (+/- 40% Tolerance)
Z Resolution 1.78 µm (,00007”)
Lateral Resolution (X-Y) 8µm (.003”)
Minimum Paste Deposit 51µm (.002”)